IPC J-STD-033D Handling of Moisture Sensitive Devices, download

Beskrivning

IPC J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow and Process Sensitive Devices, nedladdning – single licence – kan endast laddas ned till en enhet.

Standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components to help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented.

32 pages. Released April 2018.

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