IPC 6012E Specification for Rigid Printed Boards, Hard copy

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IPC 6012E Qualification and Performance Specification for Rigid Printed Board including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D. 76 pages. Released February 2020.

o Provides new acceptance criteria for back drilled holes

o Establishes new requirements for copper wrap plating of holes in new designs

o Discusses reliability issues for microvia structures in class 3 products